The integration of manufacturing industry and the Internet has great potential and broad prospects. Since it is of great significance to the development of the national economy, it also needs the government’s focus and support. It needs policies and means consistent with the laws of industrial development, and it needs more research, good choices, and effective results.
The overall idea of ​​the development concept “Guidance Opinions†is to stimulate the innovation vitality, development potential and transformation dynamics of manufacturing enterprises, and to build the “Double Innovation†platform integrating manufacturing industry and internet, and focus on the key links of manufacturing and internet integration. Accelerate the promotion of transformation and upgrading of the manufacturing industry and continuously improve the new competitive advantages of “Made in Chinaâ€. In the coming period, in order to deepen the integration of manufacturing and the Internet, we must adhere to the following principles: First, we must insist on innovation-driven and stimulate new transformational momentum.
Innovation is an important engine for the development of manufacturing and a key core for building a strong manufacturing nation. The Internet breaks through the boundaries between regions, organizations, and technologies, promotes efficient interaction among manufacturing innovation subjects, rapid product iterations, profound model changes, and deep user participation, and new carriers and new models for manufacturing manufacturing space and innovation workshops continue to emerge, boosting manufacturing. The industry shifts from factor-driven to innovation-driven.
The second is to adhere to the development of integration and to create a new manufacturing model. Deepening the integration of manufacturing and the Internet can give full play to the dual advantages of China's manufacturing industry with complete categories, independent and complete, large scale, and active use of China's Internet application innovation, industry scale leadership, and talent capital accumulation, and promote the development of manufacturing companies and Internet companies. The comprehensive integration of technology industries, production systems, and business models has created new manufacturing models such as networked collaborative manufacturing, personalized customization, and service-oriented manufacturing.
The third is to adhere to the policy of splitting the industry and cultivate new competitive advantages. Some enterprises in different industries and regions in China, some of which are in the industrial 2.0 stage, need to make up classes, some are still in the industrial 3.0 stage to be popularized, and some are in the industrial 4.0 stage to be demonstrated. This is very rare in the global industrial powers. This is to promote the manufacturing industry. The convergence of the Internet poses a very big challenge. It is necessary to address the differences in the foundations and levels of integration of different industries and enterprises, and propose a precise policy system to foster new advantages in manufacturing competition.
Fourth, adhere to the main body of the enterprise and build a new environment for development. To deepen the integration of manufacturing and the Internet, we must firmly establish the concept of manufacturing is the key link, manufacturing is the main battlefield, manufacturing enterprises are the main force of development, give full play to the decisive role of the market in the allocation of resources, highlight the dominant position of the enterprise, the government It is to create a policy environment, provide public services, formulate and implement standards and other aspects to strengthen protection, and form a fair and orderly environment for the integration of development.
The main target “Guidance Opinions†proposes the near-term goals in 2018 and the mid- and long-term goals in 2025. At the same time, a combination of quantitative goals and qualitative targets is adopted in the setting of specific goals.
By 2018, it will be the “basketing†stage. The penetration rate of the Internet “dual-invasion†platform for key enterprises in major industries will reach 80%. Compared with the end of 2015, the number of industrial cloud enterprise users will double, the new product development cycle will be shortened by 12%, and inventory turnover. The rate increased by 25% and energy efficiency increased by 5%. The “Double-track†platform of the manufacturing industry has become a new source of kinetic energy to promote the transformation and upgrading of the manufacturing industry. It has formed a number of new manufacturing models with strong demonstration and leading effects. It has preliminarily formed a new manufacturing ecology with cross-border integration, and the manufacturing industry has been digitized and networked. The intelligentization has made significant progress and has become a core driving force for consolidating the position of a large manufacturing country and accelerating its advancement toward becoming a manufacturing power.
By 2025, it will be a “step up†stage, striving to achieve the integration of manufacturing and the Internet. The “dual-invented†system is basically complete, a new fusion development model is widely used, a new manufacturing system is basically formed, and the comprehensive competitiveness of the manufacturing industry is greatly enhanced.
Since 2009, the Ministry of Industry and Information Technology has organized self-assessment, self-diagnosis and self-assessment of the development level of 59 sub-sectors and 55,000 enterprises across the country. The “Guidance Opinion†has been calculated using the above-mentioned enterprises as samples. Specific indicators for 2018 (see the table below for specific calculation basis).
The main tasks of the "Guidance Opinions" for the main task include creating two platforms, nurturing three models, and upgrading three capabilities.
Build two platforms to create two platforms, namely the construction of a “double-creation†platform for large-scale manufacturing enterprises based on the Internet and third-party “dual-invasion†service platforms for small and medium-sized enterprises, creating a “double-creation†new cooperation between large and small enterprises Ecology.
Mass entrepreneurship and innovation are the major strategic arrangements of the Party Central Committee and the State Council. Manufacturing is the main battleground for “double creation,†and large-scale manufacturing companies are the main force for “double creation,†and the “double creation†platform for large enterprises is manufacturing and the Internet. Deep fusion of important carriers. Large enterprises are large in size, have many resources, and have strong influence in the industry. They are both resource gold mines for entrepreneurship and innovation, and they are also the vanguards of entrepreneurial innovation. The industry-oriented open “dual-creation†platform established by large enterprises is a highland for technological research, business incubation, investment and financing, and talent cultivation, and provides a new path for the coordinated development of large and medium-sized enterprises. The Haier Group has established an Open Innovation Platform (HOPE), which has gathered more than 100,000 innovation resources and realized real-time interaction with global experts, users, and enthusiasts, which has greatly increased the efficiency of product development. China Aerospace Science and Industry Corporation has established a space cloud network ecosystem characterized by “combination of online and offline integration, manufacturing and service integration, and entrepreneurship and innovation†to provide cloud manufacturing and innovation for government, industry organizations, and enterprises. The number of registered users of the platform has surpassed 100,000 for services such as entrepreneurship, industrial product stores, public services, and ecosystem support.
Cultivate three models and cultivate three models. That is, support and encourage manufacturers and Internet companies to carry out various forms of cross-border cooperation and integration development, and actively foster networked production models such as networked collaborative manufacturing, personalized customization, and service-oriented manufacturing. Enhance the innovation vitality and transformational power of manufacturing companies.
The new generation of information and communication technologies and the integration of the real economy with the Internet as the core has become a new engine driving the transformation and upgrading of the manufacturing industry, and a number of new manufacturing models have emerged. First of all, based on the Internet's networked collaborative manufacturing platform, breaking geographical limits, through a more flexible and more efficient way to gather resources, can achieve internal and inter-enterprise R & D design, production and manufacturing of collaborative sharing. China COMAC achieved product R&D and manufacturing under the global collaborative network platform environment. Among them, more than 77% of the 31,000 parts of the ARJ21 regional aircraft were cooperatively developed among more than 10 countries and 104 suppliers worldwide. And manufacturing finished. Second, traditional products will be replaced by smart products that have the functions of sensing, storage, and communication. Consumers are becoming prosumers who are deeply involved in the entire manufacturing process. Traditional high-volume centralized production methods accelerate the decentralization and personalization. Custom production mode changes. Shandong Qingdao Red Collar Group leads the clothing personalized customization model. Consumers can directly put forward demands on the service platform. The flexible production line can respond quickly. This model not only controls the production cost in a batch production form, but also is personalized. The product form meets the needs of users. Third, under the increasingly fierce market competition, the rising cost of production factors, and the increasingly convenient supply and demand docking, manufacturing itself has become increasingly low in the value-added component of manufacturing products, and value-added services have gradually become a new focus of corporate competition. . XCMG, Sany Heavy Industry, Shaanxi Drum Group and other companies carry out lifecycle services such as remote monitoring, diagnosis and maintenance through technologies such as the Internet. Sany Heavy Industry has provided real-time monitoring and remote maintenance services for more than 100,000 devices worldwide. The newly added profits in 3 years exceeded RMB 2 billion, reducing service costs by 60%.
Strengthen the three capabilities and strengthen the three capabilities, namely, to strengthen the basic technologies, solutions, and security guarantees that support the integration of the manufacturing industry and the Internet, and reinforce the foundation for the integration of development to stimulate new momentum for the development of the manufacturing industry.
From the perspective of seizing the commanding heights of industrial competition and creating an ecological system for industrial development, the "Guidance Opinions" proposes three capabilities that support the integration of manufacturing and the Internet.
First of all, in terms of integrating technological support between the manufacturing industry and the Internet, it is proposed to speed up the construction of new infrastructure such as automatic control and perception of key technologies, industrial clouds and intelligent service platforms, and industrial Internet. This is not only an enhancement of the industry’s 2.0 and 3.0 “make up†reality. Needs are also an objective requirement for supporting our country to achieve the development of Industry 4.0.
Secondly, in the area of ​​integrated development solutions for manufacturing and the Internet, we proposed the implementation of the Fusion Development System Solution Capacity Improvement Project, which will focus on the construction of intelligent manufacturing units, smart production lines, smart workshops and smart factories in key industries, and cultivate a number of system solutions for key industries. The program provider organizes pilot demonstrations of industrial applications and strives to form a group of outstanding solutions for the development of integrated industries.
Secondly, regarding the integration of manufacturing and Internet security protection, it proposes the implementation of industrial control system safety and security improvement projects, improvement and perfection of industrial information security management and other policies, laws and standards systems, carry out safety protection pilot demonstration, relying on existing research institutions to build safety The Safeguard Center is committed to solving the problem of the lack of security protection for the integration of manufacturing and the Internet.
Policies and measures to ensure the full realization of the "Guidance Opinion" goals and tasks, combined with existing related policies such as "Made in China 2025", "Internet Plus" and "Double Innovation", the "Guidance Opinion" proposes a more targeted and effective approach. Policies and operability measures focus on strengthening the guidance and protection of state-owned enterprise reform, fiscal finance, and land use housing.
The first is the reform of state-owned enterprises. Promoting large-scale manufacturing enterprises to "double-innovation", focusing on mechanism innovation, the difficulty in mechanism innovation, breakthroughs in mechanism innovation. Encourage central enterprises to set up innovative investment funds, guide local industrial investment funds and social capital, and support the construction of large-scale enterprises' Internet "double creation" platform, innovation and creativity incubation, transformation of scientific and technological achievements, and cultivation of emerging industries.
The second is in taxation policy. In connection with the pilot reform and reform, we will support manufacturing companies to develop new businesses based on the Internet or joint ventures and cooperation with Internet companies to implement new VAT policies applicable to new businesses. Most of the existing Internet companies have implemented a 6% VAT rate. If the platforms set up by manufacturing companies can implement independent accounting and become independent taxpayers, they should be supported by a preferential VAT rate. In order to further speed up the implementation of the pilot reform and reform, we should promote the implementation of relevant taxation implementation rules for manufacturing enterprises to launch new businesses and mobilize the enthusiasm of manufacturing companies for new business development.
Among them, the new business of integrating manufacturing industry with the Internet mainly includes the information-sharing, quality control, product traceability, remote operation and maintenance and other services provided by the manufacturer during the product life cycle, and information technology consulting services derived from the application of the Internet. Information system integration services, data processing and operations services, cloud services, information security and other information technology services, and various platform-based service businesses generated during the application of the Internet.
The third is in fiscal policy. Give full play to the guidance and leading role of existing special funds, increase investment in the key links and key areas of the integration of manufacturing and the Internet, and focus on supporting the intelligent transformation of equipment and the demonstration and demonstration of the construction and operation of the “double-invasion†platform for manufacturing enterprises. Give full play to the existing special funds and fund functions such as industrial transformation and upgrading funds, national integrated circuit industry investment funds, SME development funds, emerging industries, investment funds, etc., and focus on supporting system solutions to enhance capabilities and manufacturing “dual-invasion†public service platforms Construction.
The fourth is the use of housing land policy. Applying industrial land policies to support large-scale manufacturing enterprises to carry out "double-creation" business, and support manufacturing enterprises to use stocked real estate and land resources to develop new Internet-based businesses and new businesses such as "Double Creation." In addition, the "Guiding Opinions" also proposes policy measures in terms of institutional mechanisms, personnel training, and international cooperation.
Ball Grid Array (BGA), a type of surface-mount packaging (a chip carrier) used for integrated circuits.
OEM needs smaller and more diverse packaging options to meet product design challenges and maintain cost competitiveness in their respective markets. Ball grid array (BGA) packaging is becoming more and more popular to meet these design requirements. In addition, they are ideal solutions, because I/O connections are located inside the device, increasing the ratio of pins to PCB area. In addition, BGA with strong solder balls is stronger than QFP lead, so it is more robust.
Ball-Grid Array (BGA) Packages Become PCB Design Mainstream
BGA PCB Design Guidelines And Rules
BGA PCB Design Rules
In order to keep up with the technological progress of chip manufacturers, BGA software packages for embedded design have made remarkable progress in the past few years.
This special type of packaging can be decomposed into standard BGA and micro BGA.
With today's electronics technology, the demand for I/O availability poses a number of challenges, even for experienced PCB designers, due to multiple exit routes.
Correct BGA partitioning first takes into account uniformity of the partitioning, itself. Because, precise BGA partitioning on a PCB is a crucial design aspect to minimize or eliminate crosstalk and noise, as well as manufacturing issues.
Memory signals need special consideration during BGA partitioning. They need to be away from oscillating signals and power supply switching. This is important because memory signals needs to be clean. If traces carrying these signals are in the proximity of oscillating signals or switching power supply signals, they produce ripples in the memory signal traces, thereby reducing system speed. The system is operational, but at less than optimal speed levels.
BGA PCB Design Guidelines
BGA Design Strategy 1: Define an appropriate exit path
The main challenge for PCB designers is to develop appropriate exit routes without causing manufacturing failures or other problems. Several PCBs need to ensure proper fan-out wiring strategies, including pad and pass size, I/O pin number, layers required for fan-out BGA and line width spacing.
BGA Design Strategy 2: Identify the Layers Required
Another question is how many layers the PCB layout should have, which is by no means a simple decision. More layers mean higher overall cost of the product. On the other hand, sometimes you need more layers to suppress the amount of noise PCB may encounter.
Once the alignment and space width of PCB design, the size of through holes and the alignment in a single channel are determined, they can determine the number of layers they need. Best practice is to minimize the use of I/O pins to reduce the number of layers. Usually, the first two outer sides of the device do not need through holes, while the inner part needs to arrange through holes below them.
Many designers call it dog bones. It is a short path of the BGA device pad, with a through-hole at the other end. The dog bone fan comes out and divides the equipment into four parts. This allows the remaining internal padding to be accessed by another layer and provides escape paths away from the edge of the device. This process will continue until all mats are fully developed.
BGA Package Types
There are six different BGA packages.
1. Moulded Array Process Ball Grid Array (MAPBGA): It is a BGA package which provides low inductance and simple surface mounting.
2. Plastic Ball Grid Array (PBGA): Again, this BGA package provides low inductance, simple surface mounting, high reliability and is cheap.
3. Thermally Enhanced Plastic Ball Grid Array (TEPBGA): Just like its name sound, this BGA package can handle great levels of heat dissipation. Its substrate has solid copper planes.
4. Tape Ball Grid Array (TBGA): You can use this BGA package as a solution for medium- to high- end applications.
5. Package on Package (PoP): It will permit you to put a memory device on some base device.
6. Micro BGA: This BGA package is quite small when compared with standard BGA packages. Currently, you will see 0.65, 0.75 and 0.8 mm pitch size dominating in the industry.
BGA PCB Assembly
Previously, Engineers were not sure whether PCB BGA assembly would be able to achieve the reliability level of traditional SMT methods. However, at present, this is no longer a problem, because BGA has been widely used in prototype PCB assembly and mass production PCB assembly.
You will need to use reflow methods to solder a BGA package. Because only reflux method can ensure solder melting under BGA module.
We have a wealth of experience handling all types of BGAs, including DSBGA and other Complex Components, from micro BGAs (2mmX3mm) to large size BGAs (45 mm); from ceramic BGAs to plastic BGAs. We are capable of placing minimum 0.4 mm pitch BGAs on your PCB.
PCB BGA Advantages
With PCB BGA, you will get the following advantages:
1. BGA package eliminates the issue of developing small packages for ICs with lots of pins.
2. Again, when compared with packages with legs, The BGA package has a lower thermal resistance when placed on the PCB.
3. Do you know which property causes unwanted signals distortion in high-speed electronic circuits? The unwanted inductance in an electrical conductor is responsible for this phenomenon. However, BGAs have very little distance between PCB and the package which in turn leads to lower lead inductance. Thus, you will get top-class electrical performance with pinned devices.
4. With BGAs, you can effectively utilize your printed circuit board space.
5. Another advantage that will come with BGA is the reduced thickness of the package.
6. Last but not least, you will get enhanced re-workability because of bigger pad sizes.
Additional Information
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